Tmeic Receives Orders For Busbar Bonding Machines From Chinese Firm

TMEIC Receives Orders for Busbar Bonding Machines From Chinese Firm

Toshiba Mitsubishi-Electric Industrial Systems Corp (TMEIC) announced April 19, 2017, that it has received orders for three units of the "TMBBM" busbar bonding machine from Triumph PV Materials Ltd (a China-based solar panel manufacturer).

Triumph PV Materials will introduce the TMBBM to its production line for CIGS solar panels. It is a solar panel manufacturer affiliated with China National Building Materials Group Corp.

Agc To Market Self-adhesive Glass For Optical Bonding That Produces More Vivid And Clear Display Devices

AGC to Market Self-Adhesive Glass for Optical Bonding that Produces More Vivid and Clear Display DevicesAGC, a world-leading manufacturer of glass, chemicals and high-tech materials, announced today that the Company will release its new self-adhesive glass for optical bonding that bonds directly to display devices used in tablets and other electronic products. The product, which significantly simplifies the process of bonding cover glass directly to display devices, will greatly contribute to the proliferation of more vivid and clear displays. Optical bonding optimizes the refractive index of resin to minimize the loss of light for enhanced visibility.

Hitachi Develops Low-melting-point Glass For Bonding Purposes

Hitachi Develops Low-melting-point Glass for Bonding PurposesHitachi and Hitachi Chemical co-developed low-melting-point glass that can be used for bonding at a temperature of 220 to 300°C.

They started sample shipment Nov 26, 2012, planning to begin volume production in 2014. Hitachi Chemical aims to achieve sales of ¥2 billion in 2015 with its low-melting-point glass adhesives including the newly-developed one.

Mitsubishi Develops World's First 12-inch Wafer Bonding Machine Capable Of Producing 3-d Integrated Lsi Circuits At Room Temperature

Mitsubishi Develops World's First 12-inch Wafer Bonding Machine Capable of Producing 3-D Integrated LSI Circuits at Room TemperatureMitsubishi Heavy Industries, Ltd. (MHI), which fully owns Mitsubishi Heavy Industries America, Inc. (MHIA), has developed the world's first fully automated 300 millimeters (12-inch ) wafer bonding machine, dubbed the "Bond Meister MWB-12-ST," capable of producing 3-dimensionally integrated LSI (large–scale integration) circuits at room temperature.